Technology, which used for the manufacture of micro assembly and microblocks:

  • Micro assembly uncased element by welding;
  • Welding and brazing of radioelement gold contact on the pads of the passive part.
  • Diagnostic nondestructive testing  of electronic products (EP);
  • Measurement of the electrical parameters of the IEP to meet specifications;
  • Climatic tests of the EP;
  • Selection of the EP to specify the electrical parameters;
  • Analysis of the causes of possible failure;
  • Research failures of electronic equipment at all stages.