The company provides services to perform following works:
For the manufacture of the equipment:
- Installation of bilateral and multi-layer printed circuit board printing;
- Installation unit and devices using circuit harness;
- Connection units, device and equipment containers;
- Bonding parts using adhesives, such as VC-9, K-300, adhesive mastic In-9m;
- Applying the epoxy, acrylic and urethane lacquers;
- Hermetic sealing devices of laser welding with inert gas;
- Test blowing argon and “hyperbaric aquarium”;
- Mechanical testing (vibration resistance and strength);
- Climatic testing (heat, cold);
- Testing of termal vacuum chamber to the impact of reduce atmospheric pressure with temperature change;
- manufacturing circuit harness
- manufacturing winding articles
- Monitoring and control of electrical parameters of the equipment;
- Electrically testing equipment;
- Comprehensive test in “anechoic chamber” conditions.
For the manufacture of products in the microelectronic design:
- Vacuum applying of copper, chromium, nickel, gold and other metals;
- Vacuum applying resistive layers: PC alloys, cermets;
- Galvanic deposition films of copper, gold;
- Photolithography boards using metal photo mask;
- Dimensional processing boards along the contour and drill holes of 0.5 mm;
- Control of adhesion;
- Control welding.
