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Technology, which used for the manufacture of micro assembly and microblocks:
- Micro assembly uncased element by welding;
- Welding and brazing of radioelement gold contact on the pads of the passive part.
- Diagnostic nondestructive testing of electronic products (EP);
- Measurement of the electrical parameters of the IEP to meet specifications;
- Climatic tests of the EP;
- Selection of the EP to specify the electrical parameters;
- Analysis of the causes of possible failure;
- Research failures of electronic equipment at all stages.